Electric Field-assisted Polishing Using Electrophoresis Phenomenon (2nd Report): Polishing of Silicon Nitride under Applied Load

摘要

Polishing of silicon nitride has been conducted by using a newly-developed finishing setup which is able to give the polishing pressure to the workpiece. The polishing is made by using an electrophoresis phenomenon of fine grain in liquid. When the electric power of DC voltage is supplied to the electrode set into the polishing compound, the grain moves and causes the polishing action to the workpiece surface. The polishing pad is put onto the stainless disc electrode. It is found from the experiments that unwoven polishing pad and reddish ferrite grain are suitable for the finishing of silicon nitride. Experimental results show that the stock removal rate increases with both the applied potential and load. The characteristics of surface polished are examined by X-ray photo spectroscopy. Photo electron spectra observed suggest that the mechanochemical actions arise on the surface of silicon nitride during the polishing process.